APPARATUS FOR TAPING FLIP-CHIP LIGHT EMITTING DIODE

摘要

Disclosed is an apparatus for taping a flip chip light emitting diode (LED), which picks up flip chip LEDs one by one from a flip chip LED wafer, sequentially puts the flip chip LEDs into a plurality of pockets formed on a tape, and tapes the pockets to close the pockets, capable of enhancing the speed and efficiency of a packaging operation, The apparatus for taping a flip chip LED comprises: a carrier tape supply unit continuously supplying a carrier tape in which a plurality of pockets are arranged at equal intervals in a longitudinal direction ceaselessly; a carrier tape collecting unit collecting the carrier tape discharged from the carrier tape supply unit; a carrier tape feeding unit transferring the carrier tape discharged from the carrier tape supply unit to the carrier tape collecting unit; a wafer stage supporting the flip chip LED wafer in which a plurality of flip chip LEDs are arranged on the same plane; an LED pickup and mounting unit picking up the flip chip LED from the wafer stage, and inserting and mounting the picked-up flip chip LED into a pocket of the carrier tape moving between the carrier tape supply unit and the carrier tape collecting unit; and a pocket closing unit covering the flip chip LED-mounted pocket with a cover tape and closing the pocket.