发明名称 MOLDABLE ADHESIVE WAFERS
摘要 Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.
申请公布号 US2016151197(A1) 申请公布日期 2016.06.02
申请号 US201414907166 申请日期 2014.05.23
申请人 CONVATEC TECHNOLOGIES INC. 发明人 Johnsen Kenneth
分类号 A61F5/448;A61F5/443 主分类号 A61F5/448
代理机构 代理人
主权项 1. A moldable adhesive comprising: at least two adhesive layers; and at least one layer of thin, flexible, elastic film between two adjacent adhesive layers to form a composite adhesive structure, wherein the moldable adhesive is formed by rolling or folding the composite adhesive structure onto itself such that the inner surface of the composite structure upon rolling provides a counteracting force to allow the edge of the rolled composite adhesive structure to partially return to its original size and shape.
地址 Las Vegas NV US