| 摘要 |
Provided are: a polyamic acid resin composition, polyimide resin composition, and polyimide oxazole resin composition of which a post-heat-treatment film has superior heat resistance, transparency, and low birefringence; and a flexible substrate containing same. The polyamic acid resin composition is characterized by containing: (a) a polyamic acid having as the primary component the structural unit represented in general formula (1); and (b) a solvent. (In general formula (1): X1 and X2 each independently represent a hydrogen atom or a monovalent organic group having 1-10 carbon atoms; R1 represents a tetravalent organic group having 4-40 carbon atoms having an alicyclic structure that is a monocycle or a fused polycycle, or a tetravalent organic group having 4-40 carbon atoms wherein organic groups having a monocyclic alicyclic structure are bonded to each other directly or with a cross-linking structure therebetween; and R2 represents a divalent organic group having 2-40 carbon atoms and having at least two hydroxyl groups.) |
