| 摘要 |
The present invention relates to a waterproofing light emitting diode (LED) module molding apparatus. More specifically, the waterproofing LED module molding apparatus of the present invention couples a transparent lens in an upper part of an LED of a printed circuit board (PCB), integrally forms a case with an in-molding or an insert method, thereby having excellent waterproofing properties and also maintaining the waterproofing properties for a long period of time so as to provide safety on a product quality compared to the existing structure of attaching an adhesive tape by a sealing structure for filling and forming a resin material in a pin hole opened in a lower part of the PCB to block. |
