| 发明名称 |
SEMICONDUCTOR DEVICE BONDING MATERIAL |
| 摘要 |
A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy. |
| 申请公布号 |
EP2617515(A4) |
申请公布日期 |
2016.06.01 |
| 申请号 |
EP20110814671 |
申请日期 |
2011.08.03 |
| 申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
SAKAMOTO YOSHITSUGU;YAMADA HIROYUKI;YAMANAKA YOSHIE;OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;TADOKORO KENZO |
| 分类号 |
B23K35/14;B22F3/26;B23K1/00;B23K35/02;B23K35/26;B23K35/30;B23K35/40;B23K101/40;C22C1/08;C22C9/02;C22C13/00;H01L21/52;H01L23/00;H01L23/373;H05K3/34 |
主分类号 |
B23K35/14 |
| 代理机构 |
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代理人 |
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