PHOTOSENSITIVE RESIN COMOPSITION

摘要

The present invention relates to a photosensitive resin composition and, more specifically, to a photosensitive resin composition which enables curing at the low temperature by comprising a thermal acid generating agent represented by chemical formula 1, has excellent durability such as chemical resistance of a formed pattern, has high pencil hardness and excellent developing residual film thickness, and has high transmissivity while not generating a surface disorder after treating chemicals.