| 摘要 |
This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this configuration, an electroconductive adhesive is obtained which, after curing, has heat resistance that is maintained at the solder reflow temperature, while the electroconductive adhesive is suitable for temporary bonding and has excellent punching workability. The electroconductive adhesive preferably includes 3-200 parts by weight of the elastomer (C) having a reactive functional group with respect to 100 parts by weight of the thermosetting resin (A) having a carboxyl group. |
