SEMICONDUCTOR DEVICE HAVING NETWORK-ON-CHIP STRUCTURE AND ROUTING METHOD THEREOF

摘要

The present invention provides a semiconductor device which comprises: a plurality of semiconductor chips vertically stacked and electrically coupled to one another through through-silicon vias (TSVs); a plurality of semiconductor elements formed in each of the semiconductor chips; a plurality of nodes configured to couple the semiconductor elements to one another; and a node control device installed in each of the nodes and configured to determine whether the nodes are connected to communication based on the temperature of the nodes to set the shortest communication path among the semiconductor elements. Therefore, the semiconductor device improves performance by stable heat management.