| 摘要 |
Disclosed is a wafer inspecting method. The method includes: a step of obtaining a wafer image by photographing a wafer in which multiple semiconductor dies are formed; a step of setting, on the wafer image, first shot areas comprising only inspection target dies, and a second shot areas including the inspection target dies and an edge area of the wafer; a step of detecting defects from the first shot areas by comparing the first shot areas to a reference shot image; and a step of detecting defects from the second shot areas by comparing the second shot areas to the reference shot image. Therefore, the present invention is capable of omitting a wafer arrangement step from an existing method. |
