| 摘要 |
An object of the present invention is to provide an electronic component carrying method capable of reliably carrying the electronic component in every cavity even under a condition that a substrate is deformed. An inspection camera (34a) disposed on an inspection probe (34) is used to respectively identify a plurality of reference marks (2m) and a plurality of chambers (3) which are disposed on the substrate and calculates a relative position relationship between the reference marks and central positions of the chambers; then a second substrate recognition camera (38) disposed on a carrying probe (35) is used to identify a plurality of the reference marks arranged on the substrate so as to calculate the position of every reference mark in a carrying probe moving axis reference coordinate system with the moving axis of the carrying probe (35); the central position of every chamber in the carrying probe moving axis reference coordinate system is determined, based on the calculated position of every reference mark and the calculated relative position relationship; and the determined central position of every chamber is set as a carrying position of the electronic component (4). |
