发明名称 |
ANISOTROPIC CONDUCTIVE ADHESIVE AND CONNECTION STRUCTURE |
摘要 |
An anisotropic conductive adhesive includes: a conductive particle including a resin particle and a conductive metal layer that is formed on a surface of the resin particle; a thermally conductive particle that is a metal particle or an insulation coated particle, wherein the metal particle has an average particle size that is smaller than an average particle size of the conductive particle, and the insulation coated particle has an average particle size that is smaller than the average particle size of the conductive particle and includes a metal particle and an insulating layer that is formed on a surface of the metal particle; and an adhesive component in which the conductive particle and the thermally conductive particle are dispersed. |
申请公布号 |
EP2899244(A4) |
申请公布日期 |
2016.06.01 |
申请号 |
EP20130839161 |
申请日期 |
2013.09.17 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
NAMIKI, HIDETSUGU;KANISAWA, SHIYUKI;ISHIGAMI, AKIRA |
分类号 |
C09J9/02;C09J11/00;C09K5/14;H01L21/60;H01L23/36;H01L33/00;H05K7/20 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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