发明名称 |
Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same |
摘要 |
An epitaxial wafer includes a growth substrate, a mask pattern disposed on the growth substrate and comprising a masking region and an opening region, and an epitaxial layer covering the mask pattern and including a first void disposed on the masking region. The first void includes a lower void disposed between a lower surface of the epitaxial layer and the masking region, and an upper void extending from the lower void into the epitaxial layer, the lower void having a greater width than the upper void. |
申请公布号 |
US9356191(B2) |
申请公布日期 |
2016.05.31 |
申请号 |
US201514726031 |
申请日期 |
2015.05.29 |
申请人 |
Seoul Viosys Co., Ltd. |
发明人 |
Jang Jong Min;Lee Kyu Ho;Han Chang Suk;Kim Hwa Mok;Suh Daewoong;In Chi Hyun;Chae Jong Hyeon |
分类号 |
H01L33/22;H01L21/02;H01L29/06;H01L33/00;H01L33/20;H01L33/24;H01L33/32 |
主分类号 |
H01L33/22 |
代理机构 |
H.C. Park & Associates, PLC |
代理人 |
H.C. Park & Associates, PLC |
主权项 |
1. An epitaxial wafer, comprising:
a growth substrate; a mask pattern disposed on the growth substrate and comprising a masking region and an opening region; and an epitaxial layer covering the mask pattern and comprising a first void disposed on the masking region, wherein the first void comprises:
a lower void disposed between a lower surface of the epitaxial layer and the masking region; andan upper void extending from the lower void into the epitaxial layer,wherein the lower void has a greater width than the upper void. |
地址 |
Ansan-si KR |