发明名称 Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same
摘要 An epitaxial wafer includes a growth substrate, a mask pattern disposed on the growth substrate and comprising a masking region and an opening region, and an epitaxial layer covering the mask pattern and including a first void disposed on the masking region. The first void includes a lower void disposed between a lower surface of the epitaxial layer and the masking region, and an upper void extending from the lower void into the epitaxial layer, the lower void having a greater width than the upper void.
申请公布号 US9356191(B2) 申请公布日期 2016.05.31
申请号 US201514726031 申请日期 2015.05.29
申请人 Seoul Viosys Co., Ltd. 发明人 Jang Jong Min;Lee Kyu Ho;Han Chang Suk;Kim Hwa Mok;Suh Daewoong;In Chi Hyun;Chae Jong Hyeon
分类号 H01L33/22;H01L21/02;H01L29/06;H01L33/00;H01L33/20;H01L33/24;H01L33/32 主分类号 H01L33/22
代理机构 H.C. Park & Associates, PLC 代理人 H.C. Park & Associates, PLC
主权项 1. An epitaxial wafer, comprising: a growth substrate; a mask pattern disposed on the growth substrate and comprising a masking region and an opening region; and an epitaxial layer covering the mask pattern and comprising a first void disposed on the masking region, wherein the first void comprises: a lower void disposed between a lower surface of the epitaxial layer and the masking region; andan upper void extending from the lower void into the epitaxial layer,wherein the lower void has a greater width than the upper void.
地址 Ansan-si KR