| 摘要 |
The present invention relates to a light emitting device package used as a display or a lighting lamp, comprising: a flip-chip light emitting device having a first pad and a second pad; a lead frame which supports the light emitting device placed thereon and is equipped with a first electrode and a second electrode which are arranged at respective sides thereof; a first bonding medium disposed between the first pad and the first electrode; a second bonding medium disposed between the second pad and the second electrode; and a chip receiving portion which causes some portions of the light emitting device to be received on the first and second electrodes so that the light emitting device is arranged on the lead frame, wherein the chip receiving portion has a first receiving portion, in which the first bonding medium is to be received, at a portion of the lower surface thereof and a second receiving portion, in which the second bonding medium is to be received, at the other portion of the lower surface thereof. The purpose of the present invention is to provide a light emitting device package which ensures secure bonding between a light emitting device and the package, prevents short-circuit of the light emitting device, and enables automatic alignment when the light emitting device is placed on the substrate of the package. |
