发明名称 Integrated circuit with sensor area and resin dam
摘要 A technique for forming an integrated circuit die that contains an integrated sensor is provided. The integrated circuit die may be configured such that the sensor is exposed to ambient environmental conditions such that the sensor may detect ambient conditions. The integrated circuit die may be generally protected from environmental exposure by a mold resin. The mold resin may be formed in areas outside of a sensor region. Resin bleed from the mold resin into the sensor region may be prevented by the use of a resin dam that extends from the surface of the integrated circuit die. The resin dam may surround the sensor region.
申请公布号 US9355870(B1) 申请公布日期 2016.05.31
申请号 US201514597293 申请日期 2015.01.15
申请人 Silicon Laboratories Inc. 发明人 Pavelka John B.
分类号 H01L21/56;H01L23/31;G01N27/12;G01N25/00;G01N33/00;G01F1/00 主分类号 H01L21/56
代理机构 Egan, Peterman, Enders & Huston LLP 代理人 Egan, Peterman, Enders & Huston LLP
主权项 1. An sensor structure comprising: a substrate; a sensor region of said substrate, said sensor region configured to allow for an ambient access region of an ambient sensor of said substratea first resin dam on said substrate, the first resin dam extending above a surface of the substrate anda mold resin on the substrate, the first resin dam being located between the sensor region and the mold resin,wherein the first resin dam provides a barrier between the mold resin and the sensor region.
地址 Austin TX US