Apparatuses and methods for bonding substrates

摘要

An apparatus for joining substrates including a rotating drum. The drum may include an outer circumferential surface and a drum aperture in the drum outer circumferential surface. The drum may be configured to continuously advance substrates. A fluid nozzle may be moveably connected to the drum and located radially inward from the drum aperture. The fluid nozzle may be adapted to direct a fluid radially outward through the drum aperture toward the substrates. The fluid may have a temperature sufficient to at least partially melt the substrates. An anvil roll may be located adjacent the drum. The anvil roll may be adapted to rotate about an axis of rotation. A press member may be moveably connected to the drum and located radially inward from the drum aperture. The press member adapted to extend through the drum aperture to compress the substrates between the anvil roll to form a bond.

主权项

1. An apparatus for bonding substrates together, the apparatus comprising:
a drum for continuously advancing a first and a second substrate, the drum comprising a drum outer circumferential surface and a drum aperture in the drum outer circumferential surface, wherein the drum is adapted to rotate about an axis of rotation; a fluid nozzle moveably connected to the drum, located radially inward from the drum aperture, and adapted to direct a fluid radially outward through the drum aperture toward the first and second substrates; an anvil roll located adjacent the drum, the anvil roll adapted to rotate about an axis of rotation; and a press member moveably connected to the drum, located radially inward from the drum aperture, and adapted to extend through the drum aperture to compress the first and second substrates between the anvil roll to form a bond.