| 发明名称 |
Semiconductor device and lead frame having vertical connection bars |
| 摘要 |
A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body. The semiconductor device further includes connection bars extending vertically from the leads to a top surface of the package body. The connection bars connect the inner row leads to respective ones of the outer row leads before the molding process is performed. |
| 申请公布号 |
US9355944(B1) |
申请公布日期 |
2016.05.31 |
| 申请号 |
US201514677964 |
申请日期 |
2015.04.02 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
Liu Peng;He Qingchun;Wu Ping |
| 分类号 |
H01L23/495;H01L23/31;H01L21/48;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
Bergere Charles E. |
| 主权项 |
1. A semiconductor device, comprising:
a lead frame having a die support area and at least two rows of leads surrounding the die support area, wherein the two rows of leads include a plurality of inner row leads and a plurality of outer row leads; a semiconductor die mounted on the die support area and electrically connected to the two rows of leads with a plurality of bond wires; a molding material encapsulating the semiconductor die, the bond wires and the two rows of leads, wherein the molding material defines a package body and the two rows of leads are exposed on a bottom surface of the package body; and inner connection bars connected to the inner row leads, wherein the inner connection bars extend vertically from the inner row leads to a top surface of the package body, wherein the inner connection bars are connected to respective ones of the outer row leads before the molding material is provided to encapsulate the semiconductor die, the bond wires and the two rows of leads, and wherein at least one of the outer row leads has an outer connection bar extending vertically to the top surface of the package body, wherein the outer connection bar is connected to at least one of the inner connection bars before the molding material is provided to encapsulate the semiconductor die, the bond wires and the two rows of leads. |
| 地址 |
Austin TX US |
