发明名称 |
Efficient heat transfer from conduction-cooled circuit cards |
摘要 |
A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a thermal management interface adapted to transfer heat from the frame to a chassis, and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis. The assembly also has one or more of the following characteristics: (a) the thermal management interface of the conduction-cooling frame is made primarily of a first material and a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and (b) the wedgelock fastener is made primarily of a first material and a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material. A chassis for conduction-cooled card assemblies is also disclosed which comprises a housing and at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween. At least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material. |
申请公布号 |
US9357670(B2) |
申请公布日期 |
2016.05.31 |
申请号 |
US201414182803 |
申请日期 |
2014.02.18 |
申请人 |
Lockheed Martin Corporation |
发明人 |
Stutzman Randall J.;Dando, III Charles H.;Long Clint |
分类号 |
H05K7/20;B23K20/08;B23K20/00 |
主分类号 |
H05K7/20 |
代理机构 |
Wolf, Greenfield & Sacks, P.C. |
代理人 |
Wolf, Greenfield & Sacks, P.C. |
主权项 |
1. A conduction-cooled card assembly, comprising:
a conduction-cooling frame having a thermal management interface adapted to transfer heat from the frame to a chassis; a printed wiring board mounted on the conduction-cooling frame; and a wedgelock fastener adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis; wherein:
the thermal management interface of the conduction-cooling frame is made primarily of a first material, a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and the second material is atomically bonded to the first material; orthe wedgelock fastener is made primarily of a first material, a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material, and the second material is atomically bonded to the first material. |
地址 |
Bethesda MD US |