| 摘要 |
A light emitting device includes a semiconductor light emitting element that is disposed on a surface of a board, a transparent phosphor plate that includes phosphors, a transparent bonding member that fixedly bonds an upper surface of the semiconductor light emitting element to a lower surface of the phosphor plate, and a reflective layer that surrounds the semiconductor light emitting element and the phosphor plate and contains light-reflective fine particles. The semiconductor light emitting element includes an exposed portion that is provided near an outer peripheral edge of the upper surface of the semiconductor light emitting element and is not covered by the phosphor plate but exposed. A portion of an outer peripheral end surface of the phosphor plate, which is located near the upper surface of the phosphor plate, is not covered by the bonding member. |
| 主权项 |
1. A light emitting device comprising:
a semiconductor light emitting element that is disposed on a surface of a board; a transparent phosphor plate that includes phosphors; a transparent bonding member that fixedly bonds an upper surface of the semiconductor light emitting element to a lower surface of the phosphor plate; and a reflective layer that surrounds the semiconductor light emitting element and the phosphor plate and contains light-reflective fine particles, wherein the semiconductor light emitting element includes an exposed portion that is provided near an outer peripheral edge of the upper surface of the semiconductor light emitting element and is not covered by the phosphor plate but exposed, wherein a portion of an outer peripheral end surface of the phosphor plate, which is located near the upper surface of the phosphor plate, is not covered by the bonding member, wherein the exposed portion is covered by the reflective layer via the bonding member, wherein the phosphor plate includes an inclination portion that is formed at the outer peripheral end surface of the phosphor plate, the inclination portion being connected to the lower surface of the phosphor plate at an obtuse angle and inclined in such a way that the area of the lower surface of the phosphor plate becomes smaller, and wherein the bonding member includes a portion sandwiched between the upper surface of the semiconductor light emitting element and the lower surface of the phosphor plate, and a portion covering the exposed portion and the inclination portion. |
