发明名称 Solid state imaging device and manufacturing method, and electronic apparatus
摘要 A solid state imaging device includes a substrate, in which the substrate includes a photoelectric conversion unit that generates a charge according to a light amount of incident light by a pixel unit, an accumulation unit that divides the charge of the pixel unit which is generated in the photoelectric conversion unit and accumulates the charge, a first element isolation unit that is formed at a boundary of the photoelectric conversion unit of the pixel unit, and a second element isolation unit that is formed at a boundary of the accumulation unit of a divided unit of the pixel.
申请公布号 US9356064(B2) 申请公布日期 2016.05.31
申请号 US201414204847 申请日期 2014.03.11
申请人 Sony Corporation 发明人 Seko Hiroaki
分类号 H01L27/146 主分类号 H01L27/146
代理机构 Chip Law Group 代理人 Chip Law Group
主权项 1. An imaging device comprising: a plurality of pixels, wherein at least one pixel of the plurality of pixels includes: a photoelectric conversion unit that generates a charge for the at least one pixel according to an amount of incident light,a plurality of accumulation units that divides the charge of the at least one pixel generated in the photoelectric conversion unit and accumulates the divided charge, wherein the plurality of accumulation units accumulates the divided charge from the same photoelectric conversion unit of the at least one pixel,a first element isolation unit that is formed at a boundary of the photoelectric conversion unit of the at least one pixel and between a photoelectric conversion unit of an adjacent pixel, anda second element isolation unit that is formed between each accumulation unit of the plurality of accumulation units of the at least one pixel and between another accumulation unit of an adjacent pixel.
地址 Tokyo JP