| 发明名称 | Stress compensation patterning | ||
| 摘要 | An apparatus includes a device that includes at least one layer. The at least one layer includes an inter-device stress compensation pattern configured to reduce an amount of inter-device warpage prior to the device being detached from another device. | ||
| 申请公布号 | US9355967(B2) | 申请公布日期 | 2016.05.31 |
| 申请号 | US201313946135 | 申请日期 | 2013.07.19 |
| 申请人 | QUALCOMM Incorporated | 发明人 | Kim Daeik D.;Lan Je-Hsiung;Velez Mario Francisco;Zuo Chengjie;Kim Jonghae;Yun Changhan |
| 分类号 | H01L23/48;H01L23/52;H01L29/40;H01L23/00;H01L21/02;G06F17/50 | 主分类号 | H01L23/48 |
| 代理机构 | Toler Law Group | 代理人 | Toler Law Group |
| 主权项 | 1. An apparatus comprising: a device comprising a first layer located at a first side of a substrate and a second layer located at a second side of the substrate, wherein the first layer includes an inter-device stress compensation pattern configured to reduce an amount of device warpage prior to the device being detached from another device, and wherein the second layer includes a second stress compensation pattern that is different than the inter-device stress compensation pattern. | ||
| 地址 | San Diego CA US | ||