发明名称 Ceramic electronic component
摘要 A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes a terminal body and a plated film that is located on a surface of the terminal body. In addition, each of the pair of metal terminals includes a terminal bonding portion, a mounting portion, and an extension portion that is provided between the terminal bonding portions and the mounting portion. A plating-removal portion from which the plated film is removed is provided at least at a peripheral surface of the mounting portion, and thus a surface of the terminal body is exposed.
申请公布号 US9355775(B2) 申请公布日期 2016.05.31
申请号 US201414283380 申请日期 2014.05.21
申请人 Murata Manufacturing Co., Ltd. 发明人 Itagaki Yoji
分类号 H01G4/30;H01G2/06;H01G4/232;H01G4/228 主分类号 H01G4/30
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A ceramic electronic component, comprising: an electronic component body including a ceramic element assembly that includes two opposite main surfaces, two opposite end surfaces, and two opposite side surfaces, and outer electrodes, each being configured to cover each of the end surfaces and a portion of the side surfaces of the ceramic element assembly; and metal terminals, each being connected to each of the outer electrodes at positions on both of the side surfaces of the ceramic element assembly; wherein each of the metal terminals includes: a terminal body;a plated film that is located on a surface of the terminal body;terminal bonding portions that are connected to the outer electrode at positions on the side surfaces of the ceramic element assembly;a mounting portion which is connected to an electrode of a mounting substrate on which the ceramic electronic component is mounted, and which faces a lower surface of the ceramic element assembly; andextension portions, each being provided between each of the terminal bonding portions and the mounting portion to provide a gap between a surface of the ceramic element assembly which faces the mounting substrate and the mounting portion; the surface of the terminal body is exposed at a peripheral surface of the mounting portion; each of the metal terminals has a U-shaped or substantially U-shaped cross-section; the terminal bonding portions contact only the side surfaces of the ceramic element assembly; and the terminal bonding portions do not contact the end surfaces or the main surfaces of the ceramic element assembly.
地址 Kyoto JP