Method for increasing adhesion of copper to polymeric surfaces

摘要

Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.

主权项

1. A method for adhering copper to a polymeric material, comprising:
exposing a substrate to a nitrogen-containing environment to increase adhesion of first and second copper-containing layers to the substrate, the substrate comprising a tray of semiconductor devices that are at least partially covered with polymeric material; depositing, at a first power level, the first copper-containing layer onto the polymeric material surface present on the substrate; and depositing, at a second power level, the second copper-containing layer onto the first copper-containing layer, wherein the second power level is greater than the first power level.