Oxide TFT and manufacturing method thereof

摘要

Embodiments of the invention provide an oxide TFT and a manufacturing method thereof. The oxide thin film transistor comprises: a substrate; a gate electrode formed on the substrate; a gate insulation layer covering the gate electrode; an oxide active layer formed on the gate insulation layer and comprising a source region, a drain region, and a channel between the source region and the drain region; an etching barrier layer entirely covering the active layer and the gate insulation layer; and a source electrode and a drain electrode formed on the etching barrier layer and respectively provided on both sides of the channel. The etching barrier layer is a metal layer. The oxide thin film transistor further comprises a channel protective layer, which is a non-conductive oxidation layer converted from the metal layer by performing an oxidation treatment on the metal layer.

主权项

1. A method of manufacturing an oxide thin film transistor, comprising: forming a conductive film on a substrate and forming a gate electrode by a patterning process; forming an insulation film on the substrate to cover the gate electrode and function as a gate insulation layer; forming an oxide film on the gate insulation layer and forming an active layer comprising a source region, a drain region and a channel by a patterning process,
wherein the method further comprises: sequentially forming a lower metal film and an upper metal film on the active layer, forming a source electrode and a drain electrode by performing a patterning process on the upper metal film which is away from the active layer, and remaining the lower metal film which is adjacent to the active layer, and wherein the lower metal film functions as an etching barrier layer, the etching barrier layer covering the active layer and the gate insulation layer; wherein the etching barrier layer comprises a channel protective layer, the channel protective layer is located on the channel and corresponds to a position of the channel, and the channel protective layer is formed by performing an oxidation treatment on the lower metal film; wherein the etching barrier layer is provided below the source and drain electrodes and covers both upper surface and side surface of the active layer and further covers a portion of the gate insulation layer on which the active layer is not formed, and wherein the oxidation treatment is an oxygen plasma oxidation treatment, and an oxygen plasma employed in the oxygen plasma oxidation treatment is a mixed gas of O2 and BCl2.