Method of manufacturing circuit board and semiconductor package

摘要

A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.

主权项

1. A method of manufacturing a circuit board, the method comprising:
preparing a circuit board body including a core insulating layer having a first surface and a second surface opposite to the first surface, and a first conductive thin film layer disposed on the first surface of the core insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the core insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the core insulating layer; and forming one or more first wiring patterns on the first surface of the core insulating layer by removing first portions of the first conductive thin film layer, wherein the one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.