发明名称 |
Imaging device |
摘要 |
An imaging device according to the present disclosure includes: an imaging unit that is housed in an outer case and captures an image of an object; a circuit board that is disposed on a back side in the outer case and includes a semiconductor device mounted thereon for processing a signal from the imaging unit; and a metal plate that is disposed between the imaging unit and the circuit board in the outer case and is fixed to the outer case. The metal plate has a first portion opposite to the circuit board and brought into mechanical contact with the semiconductor device through a contact member, and at least two second portions formed integrally with the first portion and bent in an optical axis direction of the imaging unit. |
申请公布号 |
US9357112(B2) |
申请公布日期 |
2016.05.31 |
申请号 |
US201514594888 |
申请日期 |
2015.01.12 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Chikada Noburo;Nakase Kiyotaka;Iyoda Makoto |
分类号 |
H04N5/225;G03B17/02 |
主分类号 |
H04N5/225 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. An imaging device comprising:
an imaging unit that is housed in an outer case and captures an image of an object; a circuit board that is disposed on a back side in the outer case and includes a semiconductor device mounted thereon for processing a signal from the imaging unit; and a metal plate that is disposed between the imaging unit and the circuit board in the outer case and is fixed to the outer case, wherein the metal plate has a first portion opposite to the circuit board and brought into mechanical contact with the semiconductor device through a contact member, and at least two second portions formed integrally with the first portion and bent in an optical axis direction of the imaging unit. |
地址 |
Osaka JP |