Electronic device and manufacturing method therefor

摘要

An electronic device includes a substrate, a first conductive layer disposed over the substrate, an organic insulating layer, including an organic material, disposed over the first conductive layer and having an aperture exposing a portion of the first conductive layer, a second conductive layer, which is metallic, covering a top face of the organic insulating layer, an inner circumferential face that faces the aperture in the organic insulating layer, and the exposed portion of the first conductive layer, and an intermediate layer that includes an oxide or a nitride, disposed only between the second conductive layer and the inner circumferential face that faces the aperture in the organic insulating layer. The first conductive layer and the second conductive layer are in contact at the bottom face of the aperture in the organic insulating layer.

主权项

1. An electronic device, comprising:
a substrate; a first conductive layer disposed over the substrate; an organic insulating layer disposed over the first conductive layer and having an aperture through which a portion of the first conductive layer is exposed; a second conductive layer, which is metallic, covering a top face of the organic insulating layer, an inner circumferential face that faces the aperture in the organic insulating layer, and the portion of the first conductive layer that is exposed; and an intermediate layer that includes one of an oxide and a nitride, disposed only on a half-part of the inner circumferential face that faces the aperture in the organic insulating layer, the half-part being arranged near the first conductive layer, wherein the first conductive layer and the second conductive layer are in contact within the aperture in the organic insulating layer.