| 摘要 |
The present invention relates to a detach core substrate, a manufacturing method thereof, and a method of manufacturing a circuit substrate. According to an embodiment of the present invention, proposed is the detach core substrate which includes seed layers, bonding layers for separation, and metal layers which are laminated on upper and lower surfaces of a glass core layer, respectively. Also proposed are a method of manufacturing the detach core substrate and a method of manufacturing a circuit substrate. According to the present invention, since the glass core layer having a glass material is included in the detach core substrate, it is possible to implement the detach core substrate with a favorable modulus property and preferable heat resistance. |
