发明名称 Earphone apparatus
摘要 Earphone apparatus (40) comprising: a substantially planar substrate (43) defining at least one electrical connection path (44); an electro-acoustic driver (41) and sensing microphone (42) each mounted on the substrate (43) and connected to the at least one electrical connection path (44); wherein the substrate (43) at least in part defines an acoustic waveguide (47) having a part extending through the substrate (43) for conveying sound from outside of the earphone apparatus (40) to the sensing microphone (42); and the part of the acoustic waveguide (47) extends through the substrate (43) substantially normal to the thickness of the substrate (43).
申请公布号 US9357283(B2) 申请公布日期 2016.05.31
申请号 US201214003321 申请日期 2012.03.06
申请人 Soundchip SA 发明人 Darlington Paul
分类号 H04R1/02;H04R1/10 主分类号 H04R1/02
代理机构 Lempia Summerfield Katz LLC 代理人 Lempia Summerfield Katz LLC
主权项 1. Earphone apparatus comprising: a substantially planar substrate defining at least one electrical connection path; and a transducer provided on or in the substrate and connected to the at least one electrical connection path; wherein: the transducer comprises an electro-acoustic driver and the substrate at least in part defines an acoustic waveguide having a part extending through the substrate for conveying sound from the electro-acoustic driver to an opening in the earphone apparatus for allowing sound to pass into the auditory canal of a user's ear; orthe transducer comprises a sensing microphone and the substrate at least in part defines an acoustic waveguide having a part extending through the substrate for conveying sound from outside of the earphone apparatus to the sensing microphone; andthe part of the acoustic waveguide extends through the substrate substantially normal to the thickness of the substrate.
地址 Bussigny-pres-Lausanne CH