发明名称 |
Earphone apparatus |
摘要 |
Earphone apparatus (40) comprising: a substantially planar substrate (43) defining at least one electrical connection path (44); an electro-acoustic driver (41) and sensing microphone (42) each mounted on the substrate (43) and connected to the at least one electrical connection path (44); wherein the substrate (43) at least in part defines an acoustic waveguide (47) having a part extending through the substrate (43) for conveying sound from outside of the earphone apparatus (40) to the sensing microphone (42); and the part of the acoustic waveguide (47) extends through the substrate (43) substantially normal to the thickness of the substrate (43). |
申请公布号 |
US9357283(B2) |
申请公布日期 |
2016.05.31 |
申请号 |
US201214003321 |
申请日期 |
2012.03.06 |
申请人 |
Soundchip SA |
发明人 |
Darlington Paul |
分类号 |
H04R1/02;H04R1/10 |
主分类号 |
H04R1/02 |
代理机构 |
Lempia Summerfield Katz LLC |
代理人 |
Lempia Summerfield Katz LLC |
主权项 |
1. Earphone apparatus comprising:
a substantially planar substrate defining at least one electrical connection path; and a transducer provided on or in the substrate and connected to the at least one electrical connection path; wherein:
the transducer comprises an electro-acoustic driver and the substrate at least in part defines an acoustic waveguide having a part extending through the substrate for conveying sound from the electro-acoustic driver to an opening in the earphone apparatus for allowing sound to pass into the auditory canal of a user's ear; orthe transducer comprises a sensing microphone and the substrate at least in part defines an acoustic waveguide having a part extending through the substrate for conveying sound from outside of the earphone apparatus to the sensing microphone; andthe part of the acoustic waveguide extends through the substrate substantially normal to the thickness of the substrate. |
地址 |
Bussigny-pres-Lausanne CH |