发明名称 Curable composition and cured product for dental use
摘要 The present invention provides a curable composition allowing a cured product having high aesthetic quality, strength and durability along with having high surface lubricating property to be formed. The curable composition according to the present invention comprises: an inorganic powder and a polymerizable monomer. The inorganic powder contains a spherical crystallization control powder. The spherical crystallization control powder has a silicon dioxide content in the range of 97 to 100 mass %. An amorphous portion and a crystalline portion are mixed within the spherical crystallization control powder. A refractive index difference is not more than 0.05 between the spherical crystallization control powder and a cured product obtained by curing only constituents other than the spherical crystallization control powder.
申请公布号 US9351815(B2) 申请公布日期 2016.05.31
申请号 US201113640773 申请日期 2011.04.13
申请人 PANASONIC HEALTHCARE CO., LTD.;KAO CORPORATION 发明人 Tsujimoto Masaya;Sakaguchi Mikio
分类号 A61K6/083;A61C13/087;C01B33/12;C01B33/18;A61K6/027;A61K6/00 主分类号 A61K6/083
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A curable composition containing an inorganic powder and a polymerizable monomer, wherein the inorganic powder contains a spherical crystallization control powder, the spherical crystallization control powder has a silicon dioxide content of 98.9 mass % or greater but 100 mass % or less, a non-crystalline portion and a crystalline portion are mixed within the spherical crystallization control powder, a refractive index difference is 0.05 or less between the spherical crystallization control powder and a cured product obtained by curing only constituents after removal of the spherical crystallization control powder from the curable composition, and the polymerizable monomer includes at least one of an acrylate monomer and a methacrylate monomer, and the spherical crystallization control powder content is in a range of 55 to 95 mass %.
地址 Ehime JP