Calibrating thermal behavior of electronics

摘要

A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

主权项

1. A method comprising the steps of:
determining a relationship between indirect thermal data for at least a first processor and a measured temperature associated with said at least first processor, during a calibration process; obtaining said indirect thermal data for said at least first processor during actual operation of said at least first processor; determining an actual significant temperature associated with said at least first processor during said actual operation using said indirect thermal data for said at least first processor during actual operation of said at least first processor and said relationship; determining a relationship between indirect thermal data for at least a second processor and a measured temperature associated with said at least second processor, during said calibration process, said at least first and second processors being collocated; obtaining said indirect thermal data for said at least second processor during actual operation of said at least second processor; and determining an actual significant temperature associated with said at least second processor during said actual operation of said at least first and second processors using said indirect thermal data for said at least second processor during actual operation of said at least second processor and said relationship between said indirect thermal data for said at least second processor and said measured temperature associated with said at least second processor.