ADDRESS-REMAPPED MEMORY CHIP, MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME

摘要

A memory chip comprises: a chip I/O pad unit which includes a plurality of I/O pins connected with an external device; and a plurality of semiconductor dies which are commonly connected with the chip I/O pad unit and each of which has the same overall memory capacity. Each of the semiconductor dies includes: a die I/O pad unit including a plurality of I/O terminals which are connected with the I/O pins of the chip I/O pad unit, respectively; a memory area which includes an active area corresponding to an active portion of the overall memory capacity and an inactive area corresponding to the rest portion of the overall memory capacity; and a conversion block which connects only the active area, except the inactive area, to the die I/O pad unit. Since the memory chip is formed by laminating a plurality of faulty semiconductor dies and has the same capacity with the overall memory capacity of a normal semiconductor die, it is possible to improve productivity without increasing sizes of a memory chip, a memory module including the memory chip, and a memory system.