发明名称 Resin pellet and method for producing the same
摘要 A resin pellet of the present invention includes a resin base material and a plurality of microparticles embedded in the resin base material. The resin pellet is covered with the plurality of microparticles on the surface of the resin base material. According to the present invention, it is possible to prevent detachment of the microparticles to be applied on the resin base material and to effectively suppress blocking of resin pellets.
申请公布号 US9353230(B2) 申请公布日期 2016.05.31
申请号 US201414152141 申请日期 2014.01.10
申请人 Du Pont-Mitsui Polychemicals Co., Ltd. 发明人 Chiba Kazuyuki;Sasai Izumi
分类号 C08J3/12 主分类号 C08J3/12
代理机构 Rankin, Hill & Clark LLP 代理人 Rankin, Hill & Clark LLP
主权项 1. A method for producing a resin pellet comprising: preparing a resin base material; embedding a plurality of microparticles in said resin base material by dispersing, in a liquid comprising water, said resin base material in a softened state and said microparticles; and drying the resin base material in which the plurality of microparticles are embedded, to remove the liquid comprising the water, wherein, a shore hardness of said microparticles is higher than a shore hardness of said resin base material, the shore hardness being measured according to JIS K7215, a degree of crystallinity of said microparticles is higher than a degree of crystallinity of said resin base material, the degree of crystallinity being measured by an X-ray diffraction method, a Vicat softening point of said microparticles is higher than a Vicat softening point of said resin base material, the Vicat softening point being measured according to JIS K7206, said resin base material contains an ethylene-vinyl acetate copolymer, a content of vinyl acetate in said ethylene-vinyl acetate copolymer contained in said resin base material is 20 to 50 mass %, said microparticles contain an ethylene-vinyl acetate copolymer, a content of vinyl acetate in said ethylene-vinyl acetate copolymer contained in said microparticles is 5 to 20 mass %, and in embedding said plurality of microparticles in said resin base material, the surface of said resin base material is covered with said plurality of microparticles.
地址 Tokyo JP