Apparatus for temporary bonding of substrate on a carrier and method thereof

摘要

An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.

主权项

1. An apparatus for temporarily bonding a substrate of a display device on a carrier, comprising:
an electrically conductive adhesion layer disposed between the carrier and the substrate; and a current supply source configured to apply a current to the electrically conductive adhesion layer, wherein the electrically conductive adhesion layer contacts the carrier and the substrate, and is formed of an adhesive that is electrically conductive and that has a temperature resistance.