| 发明名称 | Solder joint structure and solder joining method | ||
| 摘要 | A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface. | ||
| 申请公布号 | US9352408(B2) | 申请公布日期 | 2016.05.31 |
| 申请号 | US201314024830 | 申请日期 | 2013.09.12 |
| 申请人 | NIDEC CORPORATION | 发明人 | Yokogawa Tomoyoshi |
| 分类号 | B25G3/34;F16B11/00;F16B12/04;F16L13/00;B23K1/14;B23K1/00;B23K1/08;B23K1/19;B23K1/20;B23K3/06 | 主分类号 | B25G3/34 |
| 代理机构 | Keating & Bennett, LLP | 代理人 | Keating & Bennett, LLP |
| 主权项 | 1. A solder joint structure comprising: a metal pin in a shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other; wherein the at least one portion of the wound portion includes a deformed surface resulting from a partial elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly adhered to the deformed surface. | ||
| 地址 | Kyoto JP | ||