SEMICONDUCTOR WAFER PROTECTIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer surface protection sheet having excellent interfacial adhesion strength between a substrate layer and an absorption layer and having excellent followability to the unevenness of a semiconductor wafer.SOLUTION: A semiconductor wafer surface protection sheet at least comprises a substrate layer (A) and a resin layer (B) contacting with the substrate layer. Total density of the resin layer (B) is less than 875 kg/m, and the resin layer (B) contains following (B2).(B2): and an acid-modified polyolefin resin having an M value in the range of 0.2-1.0.SELECTED DRAWING: None