| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist application method capable of uniformly applying a resist solution.SOLUTION: The resist application method includes: a supply step SS to supply a resist solution to a generally center position of a substrate; and a substrate rotation step S5 to rotate the substrate after supply step SS. At a point when the supply step SS has completed, the substrate is completely stopped.SELECTED DRAWING: Figure 3 |
