| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless nickel composite plating bath, the plating bath allowing to stably precipitate a homogeneous and sufficient amount of a silicon carbide fine particle on a substrate to be plated even if no surfactant is added, and an electroless nickel composite plating product using the bath.SOLUTION: An electroless nickel composite plating bath is adopted, the bath including nickel sulfate 6-hydrate as a nickel ion source, sodium hypophosphite 1-hydrate as a reducer, lead nitrate or bismuth nitrate as a stabilizer, glycin as a complexing agent, and a silicon carbide fine particle. A content of the glycin is 11 g/L - 34 g/L, and a content of the silicon carbide fine particle is 1 g/L or more and less than 5 g/L.SELECTED DRAWING: Figure 1 |
