发明名称 |
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD |
摘要 |
A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot. |
申请公布号 |
SG10201508119X(A) |
申请公布日期 |
2016.05.30 |
申请号 |
SGX10201508119 |
申请日期 |
2015.09.30 |
申请人 |
EBARA CORPORATION |
发明人 |
YAMAGUCHI, KUNIAKI;MIZUNO, TOSHIO;KOBATA, ITSUKI;MIYAZAKI, MITSURU;TOYOMURA, NAOKI;INOUE, TAKUYA |
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