SILICA ABRASIVE PARTICLES, METHOD FOR MANUFACTURING SILICA ABRASIVE PARTICLES, AND METHOD FOR MANUFACTURING MAGNETIC-DISK GLASS SUBSTRATE

摘要

Provided is a silica abrasive with which there is no danger of scratching the object to be polished, and which does not cause a reduction in polishing speed. This silica abrasive has a ratio [(Si-OH)/Si] of silanol groups (Si-OH) within the abrasive to elemental silica (Si) of the abrasive as a whole of at least 0.4.