| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which allows wire bonding between an element and a bonding pad with great bond strength.SOLUTION: An optical semiconductor device manufacturing method comprises: a process of preparing a substrate having element mounting regions 3a, 3b which are arranged on one surface of a substrate 31 at a predetermined distances along a first direction, two bonding pads 4a, 4b arranged on gaps and cutting margin regions 35 arranged on the element mounting regions and on both sides of the bonding pads in parallel with the first direction; a process of mounting semiconductor elements 2a, 2b on the two element mounting regions, respectively; a process of connecting the semiconductor elements and the bonding pads by bonding wires 5b, 5c; and a process of cutting the substrate in the cutting margin regions. One and more first vias 33 are arranged on each of the cutting margin regions arranged on both sides of the bonding pads so as to sandwich the gap. In a process of cutting the cutting margin region in the optical semiconductor device manufacturing method, the first vias are removed while the substrate is cut.SELECTED DRAWING: Figure 4 |
