| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which improves reliability of a semiconductor device, especially a power semiconductor device, and which can be performed by a low-cost method.SOLUTION: A method of manufacturing at least one of semiconductor elements 10', 10'', 10''' having substrate adaptors 35', 35'', 35''' comprises: a step of laying conductive metal elements 12', 12'', 12'''; a step of coating a first lateral face of the semiconductor element with a contact material 11 in which the semiconductor element is arranged on a carrier element 20 with a second lateral face facing the carrier element 20; a step of positioning a laid metal element and the laid semiconductor element so as to be arranged in a manner such that a first lateral face of the laid metal element and the first lateral face of the semiconductor element coated with the contact material face each other; and a step of bonding the layered metal element to the semiconductor element coated with the contact material.SELECTED DRAWING: Figure 2 |
