CIRCUIT BOARD WITH LIFE PREDICTION FUNCTION AND LIFE PREDICTION METHOD OF SOLDER CONNECTION

摘要

PROBLEM TO BE SOLVED: To make it possible to perform life prediction of an electronic apparatus to which heat stress generated by repetition of circuit on/off is repeatedly applied for predicting with high reliability breakage of a solder connection part before the breakage is generated and actual harm is caused to the electronic apparatus caused by the breakage of the solder connection part.SOLUTION: A method for predicting life of a solder connection part caused by a breakage generated at the solder connection part with the substrate of an electronic component connected with a solder to the substrate by being mounted to the substrate on which a circuit pattern is formed includes: detecting a signal representing a state of solder connection between the substrate and a connection life prediction device at a solder connection part in a plurality of regions detected by using the solder connection life prediction device connected with a solder so as to receive thermomechanical stress larger than at the solder connection part between the substrate and the electronic component; detecting a breakage of the solder connection part from the detected signal; counting the number of detected breakages; and outputting an alarm when the number of counted breakages becomes a preset number.SELECTED DRAWING: Figure 9A