| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a substrate positioned at the side formed with a thin film part from being broken while reducing the time required for a gas removal step.SOLUTION: A first substrate 10 has plural recesses 21d which are formed in at least one of another plane 10b, a bottom plane of a concave part 20c in a second substrate 20, and another plane 20b of the second substrate 20. A thin film part 21e is formed thinly in a part positioned between an airtight chamber 31 and an outside space. Beam parts 21f which are formed in an area positioned between plural recesses 21d, 17 extending in one direction on the plane of the first and the second substrates 10, 20 and in another direction different from the one direction on the plane of the first and the second substrates 10, 20.SELECTED DRAWING: Figure 2 |
