| 摘要 |
PROBLEM TO BE SOLVED: To provide a support substrate and a composite substrate containing the support substrate and a semiconductor film that are favorably used for manufacturing a semiconductor wafer having few warps, and to provide a manufacturing method of a semiconductor wafer using the support substrate and the composite substrate.SOLUTION: A support substrate 11 contains an aluminum atom, a silicon atom, alkali earth metal atom, and inevitable impurity metal atoms other than these atoms, in which the content of the alkali earth metal atom is 0.001 mass% or more and 10 mass% or less and the content of a zirconium atom, one of the inevitable impurity metal atoms is less than 0.001 mass%. The support substrate 11 includes a mullite phase of 35 mass% or more and 65 mass% or less and an alumina phase of 35 mass% or more and 65 mass% or less as a crystal phase. The composite substrate 1 includes the support substrate 11 and a semiconductor film 13 arranged on the principal plane 11m side of the support substrate 11.SELECTED DRAWING: Figure 2 |
