Au-Sn ALLOY SOLDER PASTE, METHOD FOR PRODUCING Au-Sn ALLOY SOLDER LAYER, AND Au-Sn ALLOY SOLDER LAYER

摘要

PROBLEM TO BE SOLVED: To provide an Au-Sn alloy solder paste which makes it possible to obtain Au-Sn alloy solder usable in a high temperature environment of 300°C or more and also to achieve cost reduction, a method for producing an Au-Sn alloy solder layer, and an Au-Sn alloy solder layer.SOLUTION: The present invention provides an Au-Sn alloy solder paste which comprises Au-Sn atomized powder composed of Sn: 38 mass% or more and 54 mass% or less, with the balance being Au and inevitable impurities, and flux mixed with the Au-Sn atomized powder, where concentrations of oxygen included in the Au-Sn atomized powder are set to 50 ppm or more and 1500 ppm or less.SELECTED DRAWING: None