| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a package substrate, by which high productivity of a device package can be maintained.SOLUTION: A method for dividing a package substrate comprises: a step of dividing a package substrate (11) including a device part (15) partitioned into a plurality of device package regions (21) by a division scheduled line (19) on the surface, and an extra part (17) surrounding the device part, into a plurality of device packages (25) by cutting the substrate along the division scheduled line. The method further comprises: a release agent coating step for coating a region on the backside of the package substrate, corresponding to the extra part, with a release agent (7); a tape sticking step for sticking an adhesive tape (31) to the backside of the package substrate; and a division step for dividing the package substrate into the plurality of device packages by cutting the substrate with a cutting blade (36). In the division step, the extra part is removed from the adhesive tape by scattering the extra part separated from the package substrate by the rotation of the cutting blade.SELECTED DRAWING: Figure 2 |
