发明名称 PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board and a printed circuit board capable of reducing EMI.SOLUTION: A printed wiring board 100 includes: a conductor layer 101; and a conductor layer 102 laminated on the conductor layer 101 through an insulator layer 105. On the conductor layer 101, a signal pattern 111 is formed. On the conductor layer 102, a ground pattern 112 facing the signal pattern 111 through the insulator layer 105 is formed. The ground pattern 112 includes a tapering-off shape part 142 that tapers off toward a tip part 144 from a base end part 143 in an arrow x direction in which the signal pattern 111 is extending. A ground line 312 of a cable 300 is constructed so as to be capable of being electrically connected to the tip 144 of the tapering-off shape part 142.SELECTED DRAWING: Figure 1
申请公布号 JP2016100435(A) 申请公布日期 2016.05.30
申请号 JP20140235527 申请日期 2014.11.20
申请人 CANON INC 发明人 YAMAGUCHI HIROYUKI;YAMASHITA NOBUTERU;HOSHI SATOSHI
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
代理机构 代理人
主权项
地址