发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can inhibit resistance value variation caused when voltage applied between terminals of a resistor body composed of metal of non-metal is changed.SOLUTION: A semiconductor device 10 according to the present embodiment comprises: a substrate 1; a resistor body 5 which is formed above the substrate 1 and surrounded by an insulation layer 2; an intermediate dummy pattern 42 formed between the substrate 1 and the resistor body 5 and an upper dummy pattern 43 formed above the resistor body 5; and a plug 3 which connects the upper dummy pattern 43 and the intermediate dummy pattern 42 with the substrate 1. The resistor body 5 has a portion which overlaps the upper dummy pattern 43 and the intermediate dummy pattern 42 when viewed from the resistor body 5 side toward the substrate 1 side. A heat conductivity of each of the upper dummy pattern 43, the intermediate dummy pattern 42 and the plug 3 is higher than a heat conductivity of the insulation layer 2.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016100362(A) |
申请公布日期 |
2016.05.30 |
申请号 |
JP20140233885 |
申请日期 |
2014.11.18 |
申请人 |
ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
NAGAKURA KOTARO;YAMAMURA TAKESHI |
分类号 |
H01L21/822;H01L21/3205;H01L21/768;H01L23/522;H01L27/04 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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