| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of improving heat radiation performance.SOLUTION: The electronic apparatus comprises: a substrate 1 having a main surface 111 and a back surface 112 facing opposite sides to each other in a thickness direction, and consisting of a semiconductor material; an electronic element 71 arranged on the substrate 1; and a conductive layer 3 in continuity with the electronic element 71. An element arranging recess 14 recessed from the main surface 111 is formed in the substrate 1. The electronic element 71 is disposed in the element arranging recess 14. The conductive layer 3 includes a heat radiation pad 37 formed on the element arranging recess 14, and the electronic element 71 is bonded to the heat radiation pad 37.SELECTED DRAWING: Figure 1 |
