EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING THE SAME

摘要

The present invention relates to an epoxy resin composition for sealing a semiconductor device and a semiconductor device sealed by using the same. The epoxy resin composition for sealing a semiconductor device comprises: an epoxy resin; a curing agent; inorganic fillers; and a silicone rubber, wherein the weight ratio of the silicone rubber and the inorganic fillers is 1 : 2.5 to 1 : 15. The epoxy resin composition for sealing a semiconductor device has high expansion coefficient and can prevent soldering errors.